HSG Chemische Eigenschaften,Einsatz,Produktion Methoden

Verwenden

Thermally conductive heat sink grease applied to the base and mounting stud of transistors, diodes and rectifiers, as a coupling agent, to reduce thermal contact resistance. Ideal for sputtering target applications.

HSG Upstream-Materialien And Downstream Produkte

Upstream-Materialien

Downstream Produkte

HSG Anbieter Lieferant Produzent Hersteller Vertrieb H?ndler.

Firmenname	Telefon	E-Mail	Land	Produktkatalog	Edge Rate
Guangzhou Fu'erbo Biological Technology Co.,Ltd.	19513720913	1536198927@qq.com	China	9321	58

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• HSG