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What is Bis-(sodium sulfopropyl)-disulfide?

Jan 10,2020


Fig 1. Chemical structure formula and three-dimensional structure of Bis-(sodium sulfopropyl)-disulfide

Bis-(sodium sulfopropyl)-disulfide is a white to light yellow solid powder, mainly used in acid copper plating brightener, and can obtain decorative and functional coatings (such as printed circuit boards). Bis-(sodium sulfopropyl)-disulfide can be used with typical copper-plated formulations such as non-ionic surfactants, polyamines and other mercapto compounds, and also with dyes. If combined with sodium N, N-dimethyl-dithiocarbonylpropanesulfonate (DPS) and 3- (benzidine thiazole-2-mercapto) -propane sulfonate (ZPS) or thioureapropyl sulfate (UPS) will give better results. As an acidic copper plating intermediate, it is the main added component in copper plating additives, which can play a role in refining the crystallization of the plating layer and effectively improving the current density. In the entire market of acid copper brightener, this product has a large demand and excellent application effect[1].

Bis-(Sodium Sulfopropyl)-Disulfide is used as a brightener in copper electroplating,refining the crystal of the copper coating, and improving the current density in copper electroplating baths at a concentration of 10-50mg/L.Bis-(Sodium Sulfopropyl)-Disulfide used as a brightening agent for acid copper baths for decorative and functional deposits. It is functionally compatible with most components of typical copper bath formulation, such as non-ionic surfactants, polymeric amines and other mercapto compounds.Bis-(Sodium Sulfopropyl)-Disulfide for acid copper plating,decorative and functional availability coating (such as: printed circuit board).Bis-(Sodium Sulfopropyl)-Disulfide can be a typical copper formulations,such as non-ionic surfactant,polyamine and other thiol compounds in combination,can also be used in conjunction with the dye, if combined with DPS and EXP2887 with,you will get better results[2,3].

For acid copper plating,decorative and functional availability coating(such as: printed circuit board).Bis-(Sodium Sulfopropyl)-Disulfide,used as copper electroplating chemicals, copper electroplating intermediates,copper electroplating additives; copper plating chemicals,copper plating intermediates,copper plating additives,acid copper brightener,copper electroplating brightener,copper plating brightener.Bis-(Sodium Sulfopropyl)-Disulfide can be a typical copper formulations,such as non-io nic surfactant, polyamine and other thiol compounds in combination,can also be used in conjunction with the dye,if combined with DPS and EXP2887,you will get better results.

Bis-(sodium sulfopropyl)-disulfide is an anionic surfactant with a wide range of applications in textiles, electroplating, and medicine. The synthesis of Bis-(sodium sulfopropyl)-disulfide containing SS bond using sodium sulfide nonahydrate and 1,3-propane sultone as raw materials is divided into two steps: the reaction of sodium sulfide nonahydrate with sulfur to form an aqueous solution of sodium disulfide, and ethanol as the solvent It reacts with 1,3-propane sultone at a certain temperature to form Bis-(sodium sulfopropyl)-disulfide.

The sodium disulfide propane sulfonate mother liquor containing sodium sulfate was passed through a basic anion exchange resin at 30-60 °C and an acidic cation exchange resin at 30-60 °C in order; then the pH of the system was adjusted to 3 -7, followed by concentration, cooling, centrifugation, and drying in order; finally, high-purity sodium dithiodipropane sulfonate is obtained.

References

[1] Igor Volov, Olivier Mann, Yvonne Hoenersch. Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection[J]. Journal of Separation Science, 34(18):2385-2390.

[2] Wei Wang, Ya-Bing Li, Yong-Lei Li. Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process[J]. Applied Surface Science, 255(8):4389-4392.

[3] Chang Hwa Lee, Sang Chul Lee, Jae Jeong Kim. Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)[J]. 50(16-17):3563-3568.

[4] https://pubchem.ncbi.nlm.nih.gov/compound/117948

[5] https://www.chemspider.com/Chemical-Structure.105395.html?rid=bd6a73d7-c245-4469-b134-e05286b8807d

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