4,4'-Methylenebis(N,N-diglycidylaniline); High temperature resistant epoxy resin; AG80/MY-721; 4,4'-Methylenebis[N,N-bis(2,3-epoxypropyl)aniline]
Price | Get Latest Price |
Package | 25KG |
Min. Order: | 10KG |
Supply Ability: | 50MT |
Update Time: | 2020-03-24 |
Product Details
Product Name: 4,4'-Methylenebis(N,N-diglycidylaniline); High temperature resistant epoxy resin; AG80/MY-721; 4,4'-Methylenebis[N,N-bis(2,3-epoxypropyl)aniline] | CAS No.: 28768-32-3 |
EC-No.: 249-204-3 | Min. Order: 10KG |
Purity: 99% | Supply Ability: 50MT |
Release date: 2020/03/24 |
4,4'-Methylenebis(N,N-diglycidylaniline); AG80/MY-721;
Synonyms:4,4'-Methylenebis[N,N-bis(2,3-epoxypropyl)aniline]
Molecular Formula:C25H30N2O4
Molecular Weight:422.52
CAS:28768-32-3
EINECS:249-204-3
Density:1.15
Refractive index:1.601
Flash point:113 ºC
4,4'-Methylenebis (N, N-diglycidylaniline) Low viscosity, good processing technology, long-term high temperature resistance, good mechanical strength durability, low curing shrinkage, good chemical resistance, good radiation resistance. It is a tetraglycidylamine-type special epoxy resin, and its actual functionality is about 3-3.5. Can be cured with aromatic amines, acid anhydrides, dicyandiamide and imidazole curing agents. With its excellent adhesion, heat resistance and high modulus, it can be made into high-performance carbon fiber composite materials. 4,4'-diaminodiphenylmethane epoxy resin / 4,4'-diaminodiphenylsulfone / boron trifluoride ethylamine complex system has become a typical matrix system of 170-degree cured carbon fiber composite materials, has been Composite materials for aircraft substructures and aerospace structural composites. It can also be used as a conductive adhesive for heat-resistant adhesives. Red brown to amber viscous liquid. The epoxy resin is 111-118g / mol, and the epoxy value is 0.85-0.90mol / 100g. Tetraglycidylamine epoxy resin is characterized by multifunctionality, low viscosity, high activity, strong adhesion, high crosslink density of cured products, low shrinkage, excellent mechanical properties, heat resistance and corrosion resistance , But poor heat and humidity resistance. Its activity is 10 times that of bisphenol A epoxy resin. Tertiary amines can promote ring opening of epoxy groups. Diaminodiphenyl sulfone is used as a curing agent for curing. The tensile modulus is 3.7 Gpa, the thermal expansion coefficient is 5.7x10-5, and the heat resistance is about 246. Boron trifluoride-monoethylamine can accelerate the curing reaction. In the carbon fiber composite mandrel, the epoxy resins are high temperature tough resins AG80 / MY-721 and 648 epoxy resins. AG80 / MY-721 is used as carbon fiber composite material, glass fiber composite material, high temperature resistant adhesive, high temperature electrical casting, high temperature resistant electrical insulation material.
Company Profile Introduction
You may like
-
CAS:89-05-4
$0.00 / 25KG
-
CAS:2215-89-6
$0.00 / 25KG
-
CAS:1201-31-6
$0.00 / 25ASSAYS
Recommended supplier
Product name | Price | Suppliers | Update time | |
---|---|---|---|---|
$0.00/1KG |
VIP3Y
|
Hebei Weibang Biotechnology Co., Ltd
|
2024-10-25 | |
$5.00/1KG |
VIP4Y
|
Hebei Chuanghai Biotechnology Co,.LTD
|
2024-08-20 | |
$8.00/1kg |
VIP1Y
|
Henan Fengda Chemical Co., Ltd
|
2024-04-23 | |
$0.00/25KG |
VIP5Y
|
Hebei Mojin Biotechnology Co., Ltd
|
2023-11-10 | |
$20.00/1kg |
VIP5Y
|
Hebei Yanxi Chemical Co., Ltd.
|
2023-09-25 | |
$1.00/1KG |
VIP5Y
|
Career Henan Chemical Co
|
2020-01-09 | |
$0.00/25KG |
VIP5Y
|
Hebei Mojin Biotechnology Co., Ltd
|
2023-11-10 |
- Since: 2009-08-21
- Address: No. 1480, North Section of Tianfu Avenue, High-tech Zone, Chengdu, Sichuan Province
18980937689
chenquanxing@126.com